Printed circuit board with thermal conductive structure
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United States of America Patent
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Mar 13, 2001
Grant Date -
N/A
app pub date -
Aug 24, 1998
filing date -
Apr 22, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printed circuit board thermal conductive structure comprises a thermal spreader layer having an embossed pattern formed on its surface, an adhesive glue layer formed over the thermal spreader, and a surface metallic layer attached to the thermal spreader and the glue layer. A portion of the surface metallic layer is in direct contact or almost direct contact with the thermal spreader. Furthermore, an additional external heat sink can be attached to thermal conductive structure to increase the efficiency of heat dissipation.
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