Semiconductor chip connection components with adhesives and methods of making same
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United States of America Patent
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-
Mar 20, 2001
Grant Date -
N/A
app pub date -
Dec 11, 1998
filing date -
Oct 26, 1993
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor chip connection component is provided with an adhesive, desirably in a solid, non-tacky condition on its bottom surface. The adhesive may be present in a pattern covering less than all of the component bottom surface, so as to provide a void-free interface when the adhesive bonds the component to the top surface of a chip. The adhesive desirably is brought to a flowable condition by heat transferred from the chip itself. The connection component may include leads having base metal strips in a trace area underlying the top surface and noble metal portions protruding beyond an edge of the top layer. A flowable, curable material encapsulates the base metal sections. Because the base metal sections desirably are free of undercuts, the same can be encapsulated in a void-free manner during formation of the component.
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