Processing solution supplying apparatus, processing apparatus and processing method
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United States of America Patent
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Mar 20, 2001
Grant Date -
N/A
app pub date -
Mar 17, 1999
filing date -
Mar 18, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
In this processing solution supplying apparatus, when restarting the hydrophobic process, the air in the supply pipe is exhausted outside before performing the hydrophobic process by using a transfer gas, bypassing the process chamber. Thus, a large-sized mist of HMDS staying inside the supply pipe is not supplied to the wafer as it is, and after restarting the hydrophobic process after a prolonged stoppage of the adhesion apparatus, the vapor or mist of HMDS can be supplied uniformly to the wafer.
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