Modular semiconductor workpiece processing tool
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United States of America Patent
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Mar 20, 2001
Grant Date -
N/A
app pub date -
Jul 15, 1996
filing date -
Jul 15, 1996
priority date (Note) -
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Abstract
The present invention provides for a semiconductor workpiece processing tool. The semiconductor workpiece processing tool includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool has a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.
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