US Patent No: 6,204,079

Number of patents in Portfolio can not be more than 2000

Selective transfer of elements from one support to another support

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Abstract

A process for the selective transfer of elements from a transfer support to a reception support, the elements bonding through a first face to the transfer support according to a defined bonding energy, the elements each having a second face configured to contact with the reception support. Elements to be transferred are transferred by applying a bonding energy between them and the reception support that exceeds the bonding energy between their first face and the transfer support. Elements not to be transferred onto the transfer support are retained.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
COMMISSARIAT A L'ENERGIE ATOMIQUEPARIS3200

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aspar, Bernard Rives, FR 94 1339
Moriceau, Hubert Saint Egreve, FR 99 489
Rayssac, Olivier Grenoble, FR 74 285

Cited Art

Patent Info (Count) # Cites Year
 
EASTMAN KODAK COMPANY (1)
4,941,255 Method for precision multichip assembly 51 1989
 
GEORGIA TECH RESEARCH CORPORATION (1)
5,244,818 Processes for lift-off of thin film materials and for the fabrication of three dimensional integrated circuits 105 1992

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
SONY CORPORATION (13)
6,939,729 Method of transferring a device, a method of producing a device holding substrate, and a device holding substrate 2 2001
6,613,610 Image display unit and method of producing image display unit 52 2002
6,683,416 Device transfer method, and device array method and image display unit production method using the same 19 2002
6,969,670 Selective growth method, and semiconductor light emitting device and fabrication method thereof 2 2003
6,967,353 Semiconductor light emitting device and fabrication method thereof 1 2003
6,878,574 Alloying method for a image display device using laser irradiation 1 2003
6,872,635 Device transferring method, and device arraying method and image display unit fabricating method using the same 54 2003
7,195,687 Device transferring method, and device arraying method and image display unit fabricating method using the same 3 2004
7,319,052 Alloying method, and wiring forming method, display device forming method, and image display unit fabricating method 0 2005
7,049,227 Method for alloying a wiring portion for a image display device 0 2005
7,011,990 Alloying method using laser irradiation for a light emitting device 0 2005
7,008,827 Alloy method using laser irradiation 0 2005
7,067,339 Selective growth method, and semiconductor light emitting device and fabrication method thereof 0 2005
 
COMMISSARIAT A L'ENERGIE ATOMIQUE (10)
7,902,038 Detachable substrate with controlled mechanical strength and method of producing same 7 2002
7,713,369 Detachable substrate or detachable structure and method for the production thereof 9 2002
7,205,211 Method for handling semiconductor layers in such a way as to thin same 5 2003
6,959,863 Method for selectively transferring at least an element from an initial support onto a final support 5 2003
8,048,766 Integrated circuit on high performance chip 0 2004
8,193,069 Stacked structure and production method thereof 1 2004
8,142,593 Method of transferring a thin film onto a support 1 2006
7,883,994 Process for the transfer of a thin film 7 2007
7,960,248 Method for transfer of a thin layer 0 2008
8,389,379 Method for making a stressed structure designed to be dissociated 0 2009
 
MICRON TECHNOLOGY, INC. (7)
7,755,204 Stacked die module including multiple adhesives that cure at different temperatures 1 2003
7,169,248 Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods 4 2005
7,749,349 Methods and systems for releasably attaching support members to microfeature workpieces 2 2006
7,833,601 Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods 0 2006
7,927,975 Semiconductor material manufacture 0 2009
8,361,604 Methods and systems for releasably attaching support members to microfeature workpieces 0 2010
8,389,385 Semiconductor material manufacture 0 2011
 
ASULAB S.A. (1)
6,642,077 Method for manufacturing and assembling photovoltaic cells 0 2000
 
AVERY DENNISON CORPORATION (1)
7,989,313 Method and apparatus for creating RFID devices 0 2008
 
CANON KABUSHIKI KAISHA (1)
8,415,230 Method for transferring functional regions, LED array, LED printer head, and LED printer 0 2010
 
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (1)
8,252,663 Method of transferring a thin layer onto a target substrate having a coefficient of thermal expansion different from that of the thin layer 0 2010
 
DOW CORNING CORPORATION (1)
8,252,191 Sub-micron decal transfer lithography 0 2006
 
FUJIFILM DIMATIX, INC. (1)
7,779,522 Method for forming a MEMS 0 2007
 
OKI DATA CORPORATION (1)
6,790,695 Semiconductor device and method of manufacturing the same 9 2003
 
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES (1)
8,309,431 Method for self-supported transfer of a fine layer by pulsation after implantation or co-implantation 0 2004
 
SAMSUNG ELECTRONICS CO., LTD. (1)
7,101,729 Method of manufacturing a semiconductor device having adjoining substrates 4 2003
 
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. (1)
7,534,702 Method for manufacturing a semiconductor device 2 2005
 
VERSATILIS LLC (1)
7,687,372 System and method for manufacturing thick and thin film devices using a donee layer cleaved from a crystalline donor 21 2006