Reduced deformation of micromechanical devices through thermal stabilization
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United States of America Patent
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Mar 20, 2001
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N/A
app pub date -
Sep 8, 1999
filing date -
Sep 15, 1998
priority date (Note) -
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Abstract
A method and system of reducing the permanent accumulated deformation of a deflectable member of a micromechanical device through thermal stabilization. The accumulated deformation is due to the repeated bending or twisting of a flexible component of the micromechanical deice typically the repetitive deformation of a flexible hinge connecting a rigid member to substrate. After the device is fabricated, passivated (316), and packaged (322), the packaged device is baked (326) at a temperature of at least 120.degree. C. A 150.degree. C. bake for 12 to 16 hours is preferred. Lower temperatures required longer baking periods.
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