Circuit substrate including printed circuit board having heat-shielding portion

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6205028
SERIAL NO

09119528

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A circuit substrate includes a plurality of electronic devices including a heat-generating electronic device, and a printed circuit board having the plurality of electronic devices mounted thereon and having a slit hole for thermally isolating a portion for mounting the heat-generating electronic device and a portion for mounting other electronic devices.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
SHARP KABUSHIKI KAISHAOSAKA14907

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsumura, Hiroshi Kitakatsuragi-gun, JP 35 265

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
5305186 Power carrier with selective thermal performance 22 1993
 
CRAY RESEARCH, INC. (2)
4535385 Circuit module with enhanced heat transfer and distribution 58 1983
4628407 Circuit module with enhanced heat transfer and distribution 98 1984
 
Dell USA, L.P. (1)
* 5451720 Circuit board thermal relief pattern having improved electrical and EMI characteristics 27 1994
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (1)
* D776664 Smart card 0 2015
 
CORE WIRELESS LICENSING S.A.R.L (2)
* 7202505 High power light-emitting diode package and methods for making same 36 2005
* 2006/0243,998 High power light-emitting diode package and methods for making same 0 2005
 
I3 ELECTRONICS, INC. (1)
* 2013/0025,839 THERMAL SUBSTRATE 1 2011
 
OMRON CORPORATION (1)
7663891 Component mounting board structure and production method thereof 4 2006
 
LG INNOTEK CO., LTD. (1)
* 2013/0118,782 RADIANT HEAT CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME 0 2011
 
FUJITSU OPTICAL COMPONENTS LIMITED (1)
* 9507108 Optical module 0 2014
 
ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED (1)
* 2013/0099,364 Top-side Cooled Semiconductor Package with Stacked Interconnection Plates and Method 4 2012
 
HUAWEI TECHNOLOGIES CO., LTD. (2)
* 8330051 Multi-layer circuit board, method of manufacturing the same, and communication device 2 2010
* 2010/0200,277 MULTI-LAYER CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND COMMUNICATION DEVICE 3 2010
 
HITACHI, LTD. (3)
* 6879488 Radio frequency module 17 2002
* 2003/0128,522 Radio frequency module 9 2002
7362576 Radio frequency module 5 2005
 
BRIDGE SEMICONDUCTOR CORPORATION (2)
* 9064878 Wiring board with shielding lid and shielding slots as electromagnetic shields for embedded device 5 2013
* 2014/0048,916 WIRING BOARD WITH SHIELDING LID AND SHIELDING SLOTS AS ELECTROMAGNETIC SHIELDS FOR EMBEDDED DEVICE 0 2013
 
APPLE INC. (2)
* 6882537 Electrical assemblage and method for removing heat locally generated therefrom 11 2002
* 2005/0063,162 ELECTRICAL ASSEMBLAGE AND METHOD FOR REMOVING HEAT LOCALLY GENERATED THEREFROM 0 2002
 
LENOVO INNOVATIONS LIMITED (HONG KONG) (2)
7903422 Mobile terminal device and method for radiating heat therefrom 6 2009
* 2010/0014,255 MOBILE TERMINAL DEVICE AND METHOD FOR RADIATING HEAT THEREFROM 0 2009
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
8566773 Thermal relief automation 0 2012
 
POLARIS INNOVATIONS LIMITED (1)
7317248 Memory module having memory chips protected from excessive heat 3 2005
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
8335077 Insulating aperture in printed circuit boards 1 2008
 
IBIDEN CO., LTD. (2)
* 9258897 Wiring board and method for manufacturing the same 3 2012
* 2013/0020,120 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 6 2012
 
VALEO VISION (1)
* 6347038 Electronic assemblies with a heat sink, especially for a control module of a motor-vehicle headlight discharge lamp 4 2000
 
VISTEON GLOBAL TECHNOLOGIES, INC. (2)
* 6977346 Vented circuit board for cooling power components 8 2003
* 2003/0226,688 Vented circuit board for cooling power components 4 2003
 
GLOBALFOUNDRIES INC. (1)
* 8464200 Thermal relief optimization 2 2012
 
NEPES CORPORATION (2)
* 7906842 Wafer level system in package and fabrication method thereof 0 2007
* 2008/0290,496 WAFER LEVEL SYSTEM IN PACKAGE AND FABRICATION METHOD THEREOF 10 2007
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (1)
* 9101048 Printed wiring board and method of manufacturing printed wiring board 2 2013
 
ZF FRIEDRICHSHAFEN AG (1)
* 9265148 Printed circuit board and control device for a vehicle transmission comprising the printed circuit board 2 2012
 
DENSO CORPORATION (3)
* 6816377 Electronic control unit 22 2003
* 2003/0184,969 Electronic control unit 6 2003
7031165 Electronic control unit 20 2004
 
DELPHI TECHNOLOGIES, INC. (2)
* 7808788 Multi-layer electrically isolated thermal conduction structure for a circuit board assembly 4 2007
* 2009/0002,950 Multi-layer electrically isolated thermal conduction structure for a circuit board assembly 5 2007
 
NAGRASTAR, LLC (2)
* D780763 Smart card interface 0 2015
* D780184 Smart card interface 0 2015
 
ROHM CO., LTD. (1)
* 7054159 Printed wiring board having heat radiating means and method of manufacturing the same 9 2001
 
DAIKIN INDUSTRIES, LTD. (1)
* 2009/0256,161 POWER CONVERSION APPARATUS 2 2007
* Cited By Examiner