US Patent No: 6,205,028

Number of patents in Portfolio can not be more than 2000

Circuit substrate including printed circuit board having heat-shielding portion

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Importance

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Abstract

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A circuit substrate includes a plurality of electronic devices including a heat-generating electronic device, and a printed circuit board having the plurality of electronic devices mounted thereon and having a slit hole for thermally isolating a portion for mounting the heat-generating electronic device and a portion for mounting other electronic devices.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
SHARP KABUSHIKI KAISHAOSAKA19074

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsumura, Hiroshi Sabae, JP 30 227

Cited Art Landscape

Patent Info (Count) # Cites Year
 
Cray Research, Inc. (2)
4,535,385 Circuit module with enhanced heat transfer and distribution 53 1983
4,628,407 Circuit module with enhanced heat transfer and distribution 76 1984
 
Dell USA, L.P. (1)
5,451,720 Circuit board thermal relief pattern having improved electrical and EMI characteristics 26 1994
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
5,305,186 Power carrier with selective thermal performance 20 1993

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
DENSO CORPORATION (2)
6,816,377 Electronic control unit 18 2003
7,031,165 Electronic control unit 13 2004
 
HITACHI, LTD. (2)
6,879,488 Radio frequency module 8 2002
7,362,576 Radio frequency module 2 2005
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
8,566,773 Thermal relief automation 0 2012
8,464,200 Thermal relief optimization 1 2012
 
APPLE INC. (1)
6,882,537 Electrical assemblage and method for removing heat locally generated therefrom 7 2002
 
CORE WIRELESS LICENSING S.A.R.L (1)
7,202,505 High power light-emitting diode package and methods for making same 14 2005
 
DELPHI TECHNOLOGIES, INC. (1)
7,808,788 Multi-layer electrically isolated thermal conduction structure for a circuit board assembly 2 2007
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
8,335,077 Insulating aperture in printed circuit boards 0 2008
 
HUAWEI TECHNOLOGIES CO., LTD. (1)
8,330,051 Multi-layer circuit board, method of manufacturing the same, and communication device 0 2010
 
NEC CORPORATION (1)
7,903,422 Mobile terminal device and method for radiating heat therefrom 2 2009
 
NEPES CORPORATION (1)
7,906,842 Wafer level system in package and fabrication method thereof 0 2007
 
OMRON CORPORATION (1)
7,663,891 Component mounting board structure and production method thereof 4 2006
 
QIMONDA AG (1)
7,317,248 Memory module having memory chips protected from excessive heat 1 2005
 
ROHM CO., LTD. (1)
7,054,159 Printed wiring board having heat radiating means and method of manufacturing the same 8 2001
 
VALEO VISION (1)
6,347,038 Electronic assemblies with a heat sink, especially for a control module of a motor-vehicle headlight discharge lamp 3 2000
 
VISTEON GLOBAL TECHNOLOGIES, INC. (1)
6,977,346 Vented circuit board for cooling power components 5 2003

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