Method of making an electronic contact
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United States of America Patent
Stats
-
Mar 27, 2001
Grant Date -
N/A
app pub date -
Apr 22, 1997
filing date -
Jun 7, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.
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