Connector surface-treated with a Sn-Ni alloy
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United States of America Patent
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Mar 27, 2001
Grant Date -
N/A
app pub date -
Dec 16, 1998
filing date -
Dec 25, 1997
priority date (Note) -
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Abstract
A tin-nickel alloy containing not less than 75 wt % and less than 100 wt % of tin with the balance of nickel. The alloy is used, for example, for formation of a surface treatment layer of an electronic component which is to be soldered onto a substrate with the use of the surface mount technology. The surface treatment layer preferably has a thickness of not less than 0.1 .mu.m and less than 0.5 .mu.m. The electronic component preferably further includes a nickel deposit layer as an underlying layer interposed between a base of the component and the surface treatment layer.
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