Phenolic resin, resin composition, molding material for encapsulation, and electronic component device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Mar 27, 2001
Grant Date -
N/A
app pub date -
Feb 23, 2000
filing date -
Jun 3, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides a resin containing in the backbone chain a structural unit represented by the following Formula (I) or (II), as a novel phenolic resin having a high Tg, a low moisture absorption, a low molding shrinkage, high adhesive properties and high flow properties. The present invention also provides a resin composition and a molding material each containing the above resin, and an electronic component device having a device element encapsulated with it.
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