Filter structures for integrated circuit interfaces
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United States of America Patent
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-
Mar 27, 2001
Grant Date -
N/A
app pub date -
Feb 25, 1999
filing date -
Feb 25, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of optimizing the frequency response of an interconnect system of the type which conveys high frequency signals between bond pads of separate integrated circuits (ICs) mounted on a printed circuit board (PCB) through inductive conductors, such as bond wires and package legs, and a trace on the surface of the PCB. To improve the interconnect system, capacitance is added to the trace and inductance is added to the conductors, with the added trace capacitance and conductor inductance being appropriately sized relative to one another and to various other interconnect system impedances to optimize the interconnect system impedance matching frequency response.
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