Process for mounting electronic device and semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Mar 27, 2001
Grant Date -
N/A
app pub date -
Mar 26, 1998
filing date -
Mar 27, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.
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