Thermal management apparatus for a sealed enclosure
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 3, 2001
Grant Date -
N/A
app pub date -
Jul 23, 1999
filing date -
Jul 23, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Apparatus (30) controlling the temperature within a sealed enclosure (10) housing electronic components (E) whose operation produces heat, and whose operation should occur within a desired temperature range. A heat sink (32) extending through an enclosure endwall (14) conducts heat from within the enclosure to the atmosphere. Other heat sinks (40) mounted within the enclosure are in a thermal transfer relationship with the components for heat generated by the components to be drawn to the heat sinks away from the components. A heat pipe (50) extending between the respective heat sinks conducts the heat to the first said heat sink for heat to be expelled from inside the enclosure to the atmosphere. A heater (60, 62) within the enclosure generates heat to heat the components, and a thermostat (72, 74) senses when the temperature within the enclosure falls below a predetermined temperature to energize the heater. Heater is sized to cause a 'dry out', condition in the heat pipe when the thermostat energizes the heater. As a result, the temperature in the enclosure is maintained within the desired range by appropriately removing heat, from or generating heat within, the enclosure and controlling the heat transfer path.
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