Repair of dielectric-coated electrode or circuit defects
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United States of America Patent
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-
Apr 3, 2001
Grant Date -
N/A
app pub date -
Oct 30, 1996
filing date -
Oct 30, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of repairing or augmenting a metal line buried beneath at least one cover layer comprising the steps of creating a via through the cover layer to the metal line, repairing or augmenting the metal line, and filling the via. Also provided is apparatus for repairing or augmenting a metal line buried beneath at least one cover layer comprising means for creating a via through the cover layer to the metal line, means for repairing or augmenting the metal line, and means for filling the via. Also provided is a substrate having a metal line buried beneath at least one cover layer wherein the metal line has been repaired or augmented according to the process comprising the steps of creating a via through the cover layer to the metal line, repairing or augmenting the metal line, and filling the via.
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