Blind via laser drilling system
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United States of America Patent
Stats
-
Apr 3, 2001
Grant Date -
N/A
app pub date -
Dec 4, 1998
filing date -
Jun 5, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A laser drilling system for producing blind vias (13) in multilayered circuit boards (9) includes an RF excited sealed carbon dioxide laser oscillator (19), X-Y motion table for moving the boards during on-the-fly via formation, and a controller. A laser beam (20) is focused beneath the circuit board by a long focal length lens (17) so as to be defocused at the surface of the board. A slotted mask may be used to allow drilling of multiple vias simultaneously, air may be injected to the via to assist in material removal, glass scales may be used for feedback position control, both the mask and table may be rotatable, and a computer may be used for determining an optimal processing path.
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