Printed circuit board and method of manufacturing the same
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United States of America Patent
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-
Apr 3, 2001
Grant Date -
N/A
app pub date -
Aug 23, 1999
filing date -
Sep 22, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.
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