Printed wiring board, core substrate, and method for fabricating the core substrate
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United States of America Patent
Stats
-
Apr 10, 2001
Grant Date -
N/A
app pub date -
Dec 14, 1999
filing date -
Dec 25, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed wiring board includes a core substrate, one or more insulating resin layers laminated on at least one side of the core substrate, and a wiring layer formed at least between the core substrate and the insulating resin layer or between the insulating resin layers. The core substrate includes a composite dielectric layer that contains resin and a high-permittivity powder, and a plurality of metal layers disposed such that the composite dielectric layer is sandwiched therebetween. The composite dielectric layer and the metal layers constitute a laminated capacitor.
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