Epoxy mold compound and method
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United States of America Patent
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-
Apr 10, 2001
Grant Date -
N/A
app pub date -
Nov 24, 1998
filing date -
Dec 23, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Mold compounds for encapsulating semiconductors are disclosed. The compounds achieve high levels of adhesion to uncleaned printed wiring board substrates by minimizing the level of silicone fluid in the compound. Methods for encapsulating semiconductor dies and processes for encapsulating the dies also are disclosed.
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