Method for manufacturing raised electrical contact pattern of controlled geometry
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United States of America Patent
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Apr 10, 2001
Issued Date -
N/A
app pub date -
Feb 5, 1999
filing date -
Nov 16, 1993
priority date (Note) -
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status (Latency Note)
Importance
Abstract
An electronic assembly. The electronic assembly includes a first substrate which has a first set of contact pads and a second substrate which has a second set of contact pads. A plurality of elongate, springable interconnection elements are located between the first substrate and the second substrate. Each of the plurality of elongate, springable interconnect elements is free standing and has a portion permanently attached to a respective contact pad of the first set of contact pads and has a second portion contacting a respective contact pad of the second set of contact pads. The first and the second substrates are brought into a fixed relationship relative to one another.
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