Implantable lead and method of manufacture
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United States of America Patent
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-
Apr 10, 2001
Grant Date -
N/A
app pub date -
Apr 26, 1999
filing date -
Apr 26, 1999
priority date (Note) -
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status (Latency Note)
Importance
Abstract
An implantable, substantially isodiametric, low resistance implantable lead having at least one electrode positioned in a stimulation/sensing portion of the lead. At least the stimulation/sensing portion is unitized through partially surrounding and supporting insulation and conductive element(s) of the stimulation/sensing portion with a fused matrix of material having mechanical properties consistent with a body of the lead.
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