Apparatus and method for improving target erosion in hollow cathode magnetron sputter source
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United States of America Patent
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Apr 17, 2001
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N/A
app pub date -
May 6, 1998
filing date -
May 6, 1998
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Abstract
Magnetic field lines within a hollow cathode magnetron sputtering device are modified by various means to improve the full-face erosion profile of the hollow cathode target. These means include, varying the magnetic field of the main magnetic source, extending the magnetic field beyond the opening in the hollow cathode and adding a stationary or mobile magnetic field source adjacent to the closed end surface of the hollow cathode target. The present invention employs various embodiments which when implemented individually or in combination improve the full face erosion of a target cathode in a hollow cathode magnetron sputtering source.
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