Microelectronic components with frangible lead sections
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United States of America Patent
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-
Apr 17, 2001
Grant Date -
N/A
app pub date -
Jun 3, 1999
filing date -
Jun 3, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Flexible leads for making electrical connection in microelectronic components include a frangible intermediate section. The frangible intermediate section is formed by a region within the lead having weakened mechanical integrity. The frangible intermediate section is made by providing a sacrificial metal layer and forming a projection on the surface of the metal layer from a portion thereof. Lead forming material is deposited onto the surface of the sacrificial metal layer and over the projection. A dielectric layer is formed on the surface of the lead forming material. Upon removing the sacrificial metal layer, a frangible intermediate section is formed within the lead forming material at the location of the projection.
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