Method of fabricating electronic devices of the type including smoothing process using polishing
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United States of America Patent
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-
Apr 17, 2001
Grant Date -
N/A
app pub date -
Mar 27, 1992
filing date -
Mar 28, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a method of fabricating electronic components of the type wherein trenches formed in a substrate are filled up with a filling material deposited by a deposition process achieving etching and deposition concurrently, the improvement which comprises portions of the filling material deposited on those portion of the substrate other than those corresponding to the trenches are leveled up to the same height by an additional deposition of the filling material, or alternatively by a full-surface etch back process. With this leveling of the deposited material, a subsequent polishing operation can be performed smoothly with high accuracy. During the polishing operation, the resistance between a conductive polish-stop layer on the substrate and a surface of a polishing member contacting the substrate is monitored to determine a polish end.
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