Mold-BGA-type semiconductor device and method for making the same
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United States of America Patent
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-
Apr 17, 2001
Grant Date -
N/A
app pub date -
Oct 26, 1998
filing date -
Oct 28, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is a mold-BGA-type semiconductor device which has: a semiconductor chip which includes insulating resin film formed on at least a part of the surface of the semiconductor chip except a pad; a conductive layer formed in a region on the insulating resin film, the region including at least part corresponding to a position where a solder ball is mounted; a first metal thin wire which is wire-bonded between the pad and the conductive layer; a second metal thin wire which is wire-bonded on the conductive layer; resin part which seals the semiconductor chip, the resin part including a hole to expose part of the second metal thin wire; and a solder ball which is mounted on the hole.
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