Importance

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Abstract

A tiny ball grid array package based on a substrate. The substrate has at least an insulation layer and two copper foils laminated together. A hole is formed near the center of the substrate. A second one of the copper foils is patterned into multiple conductive traces formed on a surface of the substrate, while a first one of the copper foils has a surface partly exposed. The first copper foil is coupled with the conductive traces by vias, meanwhile, the first copper foil is grounded to form a ground plane, so as to improve the electrically properties and the heat dissipation efficiency. Bonding pads are formed in one surface of a chip. This surface is thermal-conductively connected to the grounded level, and the bonding pads are located in the hole. The bonding pads are electrically connected to a near end of a conductive trace by a conductive wire, and solder balls are attached at a far end of the conductive trace. A molding material fills the hole and covers a surrounding area of the hole to protect the bonding pads, the conductive wire, and the conductive traces, so as to cover ajunction area of the chip and the ground plane.

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First Claim