Three-dimensional electronic module and a method of its fabrication and repair
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 17, 2001
Grant Date -
N/A
app pub date -
Jun 9, 1999
filing date -
Jul 2, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention relates to an area of electronic equipment assembly using packaged and unpackaged electronic components. The invention solves a problem of creating an all-purpose construction of three-dimensional electronic modules with the possibility of employing practically any kind of packaged and unpackaged electronic components, providing high packing density, effecting heat removal and allowing good accessibility for repair. This is provided due to the arrangement of both packaged and unpackaged components in three-dimensional space in combination with effective heat removal directly from heat emitting components. Use of corrugated commutation boards and ordinary tools allows repair of any alternative design of the module without dismounting other components. This constructive solution allows an increased packing density of electronic equipment by 2-10 times in comparison with conventional constructions and increases mean time between failures (MTBF). It is possible to use this construction at any radioelectronic enterprise without employing a new production process and incurring additional expenditures.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully