Cerium oxide abrasive and method of polishing substrates
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United States of America Patent
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Apr 24, 2001
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N/A
app pub date -
Aug 10, 1999
filing date -
Sep 30, 1996
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Abstract
This invention provides a cerium oxide abrasive with which the surfaces of substrates such as SiO.sub.2 insulating films can be polished at a high rate without causing scratches. The abrasive of the present invention comprises a slurry comprising cerium oxide particles whose primary particles have a diameter of from 10 nm to 600 nm and a median diameter of from 30 nm to 250 nm and slurry particles have a median diameter of from 150 nm to 600 nm and a maximum diameter of 3,000 nm or smaller, the cerium oxide particles being dispersed in a medium.
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