Surface treatment of copper to prevent microcracking in flexible circuits
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United States of America Patent
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Apr 24, 2001
Grant Date -
N/A
app pub date -
Mar 17, 1999
filing date -
Mar 17, 1999
priority date (Note) -
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Abstract
In one embodiment, the present invention relates to a flexible laminate, comprising a first flexible polymeric film; a copper layer having a microcracking prevention layer on at least one side the microcracking prevention layer sufficient to prevent microcracks in a copper layer having a thickness of up to about 18 .mu.m during at least 50,000,000 bending cycles and/or a copper layer having a thickness of up to about 35 .mu.m during at least 20,000,000 bending cycles of the flexible laminate; and a second flexible polymeric film.
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