Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith
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United States of America Patent
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Apr 24, 2001
Grant Date -
N/A
app pub date -
Apr 14, 1999
filing date -
Apr 16, 1998
priority date (Note) -
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Abstract
In semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a curing agent and an inorganic filler, 1-90% by weight of the inorganic filler is spherical cristobalite. The compositions are able to achieve higher loadings of inorganic filler, allow easy control of the coefficient of thermal expansion, and provide high-quality cured products having improved thermal conductivity and low moisture absorption.
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