Fabrication of deformable leads of microelectronic elements
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 24, 2001
Grant Date -
N/A
app pub date -
Oct 27, 1999
filing date -
Oct 28, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An element such as a semiconductor wafer or other body is provided with leads by applying a sacrificial layer over the front surface of the body depositing leads onto the sacrificial layer so that the leads are connected to contact pads on the body and removing the sacrificial layer from beneath the leads. The sacrificial layer may incorporate thin and thick regions so that portions of the leads projecting upwardly away from the body will be formed on the thick regions of the sacrificial layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully