Flip-chip having an on-chip decoupling capacitor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 24, 2001
Grant Date -
N/A
app pub date -
Jan 8, 1999
filing date -
Jan 8, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A flip-chip having a decoupling capacitor electrically coupled to the backside thereof. The flip-chip includes a semiconductor substrate having first and second opposing surfaces with circuit elements formed within the first surface. A plurality of raised bump contacts are located on the first surface and connected to the circuit elements. A plurality of electrical interconnects are also located on or within the second surface and connected to the circuit elements. The electrodes of a decoupling capacitor are electrically coupled to the plurality of electrical interconnects.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully