Importance

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Abstract

Disclosed is a stack package and a method of manufacturing the same. The stack package of the present invention comprises a ceramic capsule. A pair of protruding portions are formed at both upper sides of the ceramic capsule. A first semiconductor chip is attached on the upper face of the ceramic capsule and a second semiconductor chip is attached on a lower face of the ceramic capsule. The first and second semiconductor chips are disposed such that their bonding pads are disposed upwardly, more particularly the second semiconductor chip has a size that its bonding pad may be exposed from both sides of the ceramic capsule. It is preferable to attach a heatsink at the lower face of the second semiconductor chip. The first and second semiconductor chips are electrically connected with a metal wire. A midway portion of the metal wire is laid on the protruding portion of the ceramic capsule. The entire resultant is encapsulated with a molding compound while exposing the portion of metal wire laid on the protruding portion and the heatsink. A conductive bump is formed on the exposed portion of the metal wire, and a solder ball is mounted on the conductive bump.

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First Claim