Integrated circuit device with integral decoupling capacitor
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United States of America Patent
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Apr 24, 2001
Grant Date -
N/A
app pub date -
May 7, 1998
filing date -
May 7, 1998
priority date (Note) -
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Abstract
A flat, thin decoupling capacitor is disposed inside an integrated circuit device in a coplanar relationship with a semiconductor chip and a bonding element. When connected to the power and ground plane of a device substrate or in a leadframe device, the decoupling capacitor is positioned close to the semiconductor chip to substantially reduce ground bounce and crosstalk from the semiconductor chip. When the decoupling capacitor is positioned to locate the semiconductor chip between itself and the device substrate or leadframe device, the decoupling capacitor shields electromagnetic interference from the semiconductor chip.
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