High-density computer module with stacked parallel-plane packaging
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United States of America Patent
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Apr 24, 2001
Grant Date -
N/A
app pub date -
Jan 12, 1999
filing date -
Jan 20, 1998
priority date (Note) -
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Abstract
A module for insertion into an expansion slot of a computer includes a primary board and a pair of auxiliary boards. The auxiliary boards are mounted in a spaced relationship on respective sides of the primary board to define air paths between the boards. The air paths allow air to circulate between the boards. The auxiliary boards each have a trace for electrically connecting the board to the primary board, and the primary board has a trace for connecting chips mounted thereon to an interface with the expansion slot. The traces of the auxiliary boards are substantially the same length. The trace of the primary boards is only slightly longer than the traces of the auxiliary boards.
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