Importance

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Abstract

A compliant, high-density land grid array connector and the process of making such a connector. The process includes the steps of: (a) forming holes in a supporting substrate; (b) forming threaded sidewalls by tapping the holes; (c) plating the threaded sidewalls to form bellows-like structures; and (d) etching a surface of the supporting substrate after the plating to leave portions of the bellows-like structures protruding past a surface of the substrate. The resulting connector includes a substrate having bellows-like contacts extending from one or both sides for resiliently engaging pads such as those of an LGA module. As an alternative, the holes may be formed as blind holes. Ends of the bellows-like contacts may be roughened. The connector may also be formed by casting the substrate in a mold box having screw-like mandrels followed by steps of mandrel removal, hole plating and surface etching.

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First Claim