Method of forming bump electrodes
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United States of America Patent
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-
May 1, 2001
Grant Date -
N/A
app pub date -
Jan 21, 1999
filing date -
Jan 22, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of forming a plurality of bump electrodes en bloc on a bump electrode formation surface of a wafer from which chips are to be separated, or on an upper surface of a plurality of chips which are separated from a wafer and placed side by side, the upper surface constituting a bump electrode formation surface, is disclosed.
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