Arrangement including a substrate for power components and a heat sink, and a method for manufacturing the arrangement
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United States of America Patent
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-
May 1, 2001
Grant Date -
N/A
app pub date -
Jun 21, 1999
filing date -
Aug 25, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In an arrangement composed of a substrate and a heat sink, the substrate is provided on a first side with at least one power component arranged on a first large-surface printed circuit trace and, on a second side opposite the power component, with a second large-surface printed circuit trace, which is connected in a thermally conductive manner to the first printed circuit trace via via holes. The substrate is mounted at the second side onto the heat sink in a thermally conductive manner, in order to achieve a good heat coupling of the substrate to the heat sink and the same time to avoid an undesirable electrical contact between the potential-carrying printed circuit traces and the heat sink. The substrate having spacer elements arranged on the second side is placed onto the heat sink and to hold it at a defined distance from the heat sink, the gap formed by the distance between the substrate and the heat sink being filled with a thermally conductive filler.
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