Heat processing apparatus
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United States of America Patent
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-
May 8, 2001
Grant Date -
N/A
app pub date -
Jan 29, 1999
filing date -
Jan 29, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
A heat processing apparatus comprises a heating section having a hot plate for heating a substrate in a heat conduction manner, refrigeration medium for decreasing temperature of the hot plate in a heat exchange manner by bring the refrigeration medium in direct or indirect contact with the hot plate, a refrigeration section for storing the refrigeration medium while cooling, a transport mechanism for taking out the refrigerant from the refrigeration section, transporting the refrigeration medium to the heating section, mounting the refrigeration medium on the hot plate, picking up the refrigeration medium from the hot plate, taking out the refrigeration medium from the heating section, and transporting the refrigeration medium to the refrigeration section, setting mechanism for setting a heat processing temperature for the substrate, and a controller for controlling temperature of the hot plate by using the refrigeration medium so as to reach the heat processing temperature set by the setting mechanism.
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