Bonding agent composition containing conductive filler and method of bonding electrode to printed conductive trace with same
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United States of America Patent
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May 8, 2001
Grant Date -
N/A
app pub date -
Jul 30, 1997
filing date -
Jul 30, 1997
priority date (Note) -
In Force
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Importance
Abstract
The invention relates to a method for using adhesive polymers containing conductive fillers to manufacture iontophoretic devices in which the conductive lead and the conducted printed trace are strongly mechanically bonded together and resulting in electronic interconnection between the conductive lead and conductive printed trace.
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