Method of fabricating a microelectronic assembly using sheets with gaps to define lead regions
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United States of America Patent
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May 8, 2001
Grant Date -
N/A
app pub date -
Aug 26, 1998
filing date -
Sep 18, 1995
priority date (Note) -
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Abstract
A sheet such as a polymeric dielectric has elongated lead regions partially separated from the main region of the sheet by gaps in the sheet, and has conductors extending along the lead regions. The lead regions are connected to contacts on a microelectronic element, and the microelectronic element is moved away from the main region of the sheet, thereby bending the lead regions downwardly to form leads projecting from the main region of the sheet.
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