Saw-singulated leadless plastic chip carrier
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United States of America Patent
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-
May 8, 2001
Grant Date -
N/A
app pub date -
Jun 10, 1998
filing date -
Jun 10, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Leadless plastic chip carriers are formed from a matrix of lead frames provided in a section of a metal strip. Each lead frame in the matrix includes a die-attach pad and multiple leads disposed in close proximity to the die-attach pad. After a semiconductor die is attached to each of the die-attach pad and wire-bonded, the leadless plastic chip carriers are formed by providing a plastic encapsulation which exposes the bottom sides of the die-attach pad and the leads. The bottom sides of the leads serve as solder pads to be used for attaching the leadless plastic chip carrier to a printed circuit board.
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