Device and method for attaching and soldering pre-formed solder spheres to the ball grid array (BGA) integrated circuit package attachment sites in high volume
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United States of America Patent
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May 8, 2001
Grant Date -
N/A
app pub date -
Dec 4, 1998
filing date -
Dec 4, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A device and method for high volume solder sphere alignment and placement including the high volume solder sphere alignment and placement for BGA and CSP packages including a pre-form stencil having a pattern of apertures formed through its cross-section, that corresponds to the pattern of the exposed conductive lands of a circuit requiring sphere alignment and placement. The apertures may be formed having diameters that are approximately 5% larger in diameter than the solder spheres. The method for high volume solder sphere alignment and placement may include the steps of prepping the workpiece, applying a thin layer of flux to the conductive lands. Aligning the pre-form stencil with the part to which the solder balls are to be aligned with and placed upon. Applying the solder spheres through the pattern of apertures onto the conductive lands. Application may take place either by brushing or by spreading the spheres with a generally U-shaped blade wherein the solder spheres are contained between the legs of the U-shaped blade during application.
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