Silicon interposer and multi-chip-module (MCM) with through substrate vias
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United States of America Patent
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-
May 8, 2001
Grant Date -
N/A
app pub date -
Jan 11, 1999
filing date -
Jan 11, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit package which includes an integrated circuit that is connected to a silicon substrate. The silicon substrate may have a via. The package may further include a solder bump that is attached to both the integrated circuit and the silicon substrate. The silicon substrate has a coefficient of thermal expansion that matches the coefficient of thermal expansion of the integrated circuit.
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