Reverse cantilever spring clip
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
May 8, 2001
Grant Date -
N/A
app pub date -
Apr 26, 1999
filing date -
Apr 27, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A reverse cantilever spring clip for providing intimate thermal contact between a heat sink and a heat generating electrical component such as an integrated circuit (IC). The spring clip includes a spring member and a retention member. The retention member has one or more legs with a securing member affixed to an outer end of the legs. The legs are configured for engaging a heat sink and a circuit board to which the IC is mounted so that the heat sink is positioned directly over the circuit board. The securing member maintains contact between the IC and heat sink.
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