US Patent No: 6,230,722

Number of patents in Portfolio can not be more than 2000

Liquid feed nozzle, wet treatment, apparatus and wet treatment method

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Abstract

The wet treatment liquid feed nozzle of the invention comprises an introducing path 10 having an introducing port 7, a discharging path 12 having a discharging port 15, a crossing section 14 formed by causing the introducing path 10 and the discharging path 12 to cross at the other ends thereof, a nozzle assembly 50 having an opening section 6 opening to an object to be treated 1, provided at the crossing section 14, and pressure control means 13, for controlling the difference between the pressure of the wet treatment liquid in contact with the object to be treated 1 and the atmospheric pressure provided at least on the discharging path 12 side so that the wet treatment liquid having been in contact with the object to be treated 1 via the opening section 6 does not flow to outside the discharging path 12.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
ALPS ELECTRIC CO., LTD.TOKYO3394
ORGANO CORPORATIONTOKYO87
OHMI, TADAHIROTOKYO220

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abe, Akira Tokyo, JP 135 1121
Imaoka, Takayuki Kamakura, JP 7 81
Kasama, Yasuhiko Sendai, JP 69 381
Mitsumori, Kenichi Miyagi-ken, JP 32 293
Ohmi, Tadahiro Miyagi, JP 857 4854
Toda, Masayuki Kanagawa, JP 53 173
Yeol, Oh Eui Miyagi-ken, JP 6 93

Cited Art

Patent Info (Count) # Cites Year
 
EASTMAN KODAK COMPANY (1)
6,047,715 Turbulent cleaning action for ink jet print heads and orifices 9 1998
 
SPECIALTY COATING SYSTEMS, INC. (1)
5,339,842 Methods and apparatus for cleaning objects 28 1992

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
LAM RESEARCH CORPORATION (42)
7,234,477 Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces 13 2002
7,240,679 System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold 5 2002
7,198,055 Meniscus, vacuum, IPA vapor, drying manifold 7 2002
7,252,097 System and method for integrating in-situ metrology within a wafer process 5 2003
7,153,400 Apparatus and method for depositing and planarizing thin films of semiconductor wafers 15 2003
7,264,007 Method and apparatus for cleaning a substrate using megasonic power 1 2003
8,062,471 Proximity head heating method and apparatus 1 2004
7,045,018 Substrate brush scrubbing and proximity cleaning-drying sequence using compatible chemistries, and method, apparatus, and system for implementing the same 3 2004
7,614,411 Controls of ambient environment during wafer drying using proximity head 0 2004
7,513,262 Substrate meniscus interface and methods for operation 1 2004
7,389,783 Proximity meniscus manifold 5 2004
7,293,571 Substrate proximity processing housing and insert for generating a fluid meniscus 2 2004
8,236,382 Proximity substrate preparation sequence, and method, apparatus, and system for implementing the same 0 2004
7,383,843 Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer 4 2004
6,954,993 Concentric proximity processing head 26 2004
7,003,899 System and method for modulating flow through multiple ports in a proximity head 2 2004
7,675,000 System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology 0 2004
7,632,376 Method and apparatus for atomic layer deposition (ALD) in a proximity system 3 2005
7,520,284 Apparatus for developing photoresist and method for operating the same 2 2005
7,810,513 Substrate preparation using megasonic coupling fluid meniscus and methods, apparatus, and systems for implementing the same 2 2005
7,143,527 System and method for modulating flow through multiple ports in a proximity head 6 2005
7,584,761 Wafer edge surface treatment with liquid meniscus 2 2005
7,127,831 Methods and systems for processing a substrate using a dynamic liquid meniscus 4 2005
7,383,601 Substrate brush scrubbing and proximity cleaning-drying sequence using compatible chemistries, and method, apparatus, and system for implementing the same 1 2006
7,464,719 Multi-menisci processing apparatus 1 2006
7,597,765 Post etch wafer surface cleaning with liquid meniscus 1 2006
7,946,303 Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscus 2 2006
7,383,844 Meniscus, vacuum, IPA vapor, drying manifold 1 2006
7,928,366 Methods of and apparatus for accessing a process chamber using a dual zone gas injector with improved optical access 0 2006
7,703,462 Reduction of entrance and exit marks left by a substrate-processing meniscus 2 2006
7,350,316 Meniscus proximity system for cleaning semiconductor substrate surfaces 3 2007
7,975,708 Proximity head with angled vacuum conduit system, apparatus and method 0 2007
8,146,902 Hybrid composite wafer carrier for wet clean equipment 0 2007
7,387,689 Methods for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces 3 2007
7,722,724 Methods for substrate processing in cluster tool configurations having meniscus application systems 0 2007
8,141,566 System, method and apparatus for maintaining separation of liquids in a controlled meniscus 0 2007
7,997,288 Single phase proximity head having a controlled meniscus for treating a substrate 0 2007
7,406,972 Substrate proximity processing structures 1 2007
7,568,488 Enhanced wafer cleaning method 1 2007
7,534,307 Methods for processing wafer surfaces using thin, high velocity fluid layer 0 2008
8,317,934 Multi-stage substrate cleaning method and apparatus 0 2009
8,313,580 Method for processing a substrate using a single phase proximity head having a controlled meniscus 0 2011
 
ASML NETHERLANDS B.V. (2)
8,208,120 Lithographic apparatus and device manufacturing method 0 2008
7,982,850 Immersion lithographic apparatus and device manufacturing method with gas supply 0 2008
 
FSI INTERNATIONAL, INC. (2)
7,913,706 Rinsing methodologies for barrier plate and venturi containment systems in tools used to process microelectronic workpieces with one or more treatment fluids, and related apparatuses 1 2008
8,235,062 Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation 0 2009
 
SHARP KABUSHIKI KAISHA (2)
6,497,240 Ultrasound cleaning device and resist-stripping device 3 2000
6,619,301 Ultrasonic processing device and electronic parts fabrication method using the same 3 2000
 
EBARA CORPORATION (1)
7,476,290 Substrate processing apparatus and substrate processing method 0 2003
 
KABUSHIKI KAISHA TOSHIBA (1)
6,875,696 Ultrasonic-wave washing unit, ultrasonic-wave washing apparatus, ultrasonic-wave washing method, method of manufacturing a semiconductor device, and method of manufacturing a liquid crystal display 2 2003
 
MICRONIC LASER SYSTEMS AB (1)
7,369,217 Method and device for immersion lithography 11 2003
 
SHIBAURA MECHATRONICS CORPORATION (1)
7,766,021 Substrate treatment apparatus 0 2007
 
TEL FSI, INC. (1)
8,387,635 Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids 0 2007
 
TOKYO ELECTRON LIMITED (1)
6,384,894 Developing method and developing unit 19 2001
 
TOKYO OHKA KOGYO CO., LTD. (1)
8,181,660 Treatment liquid permeation unit and treating apparatus 0 2009
 
Other [Check patent profile for assignment information] (1)
8,464,736 Reclaim chemistry 0 2007