Method and apparatus using colored foils for placing conductive preforms
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United States of America Patent
Stats
-
May 15, 2001
Grant Date -
N/A
app pub date -
Apr 3, 1997
filing date -
Jan 28, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method and apparatus are disclosed for placing solder balls on electronic pads on a component or substrate, such as for a ball grid array (BGA) applicator. The BGA applicator utilizes a foil(s) that is treated to provide color to the surface; the color is used to assist in inspection of the solder spheres. The solder balls can transferred to the electronic pads by holding them to openings in the foil by applying a holding force such as a vacuum applied to the solder balls through the openings in a foil. Optionally, a second material can be placed against the foil where the secondary material holds solder spheres to the apertures. After locating the solder balls to the electronic pads of a component or substrate, the solder balls are released and placed on the electronic pads by removing the holding force such as by deactivating the vacuum.
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