Boron-copper-magnesium-tin alloy and method for making same
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United States of America Patent
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May 15, 2001
Grant Date -
N/A
app pub date -
Dec 10, 1999
filing date -
Jan 9, 1998
priority date (Note) -
Expired
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Abstract
A high strength, highly electrically conductive copper-based alloy and method for producing the alloy are provided, with the alloy containing boron in the range of 0.0-2.9 at. %, magnesium in a range of about 2.8-7.6 at. %, tin in a range of about 2.1-4.3 at. %, and the balance copper and unavoidable impurities. The method for producing the high-strength, highly conductive alloy includes solution heat treating or annealing the material to dissolve the solute elements into a solid solution including the copper, rapidly quenching the material to freeze the solute elements in solid solution, and aging the material at a temperature in a range of about 400-475.degree. C. to precipitation harden the alloy material.
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