Sockets for "springed" semiconductor devices
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
May 15, 2001
Grant Date -
N/A
app pub date -
Mar 7, 2000
filing date -
Jun 30, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
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