Semiconductor device having a packaged semiconductor element and permanent vent and manufacturing method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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May 15, 2001
Grant Date -
N/A
app pub date -
Nov 23, 1999
filing date -
Jun 8, 1999
priority date (Note) -
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Abstract
In a semiconductor device, a semiconductor chip is mounted on a planar substrate approximately at the center and a hollow cavity for housing the semiconductor chip is formed by laminating an annular ring member, annular adhesive tapes, and a heat spreader plate on the substrate. A slit is formed in the adhesive tape or the ring member to provide an air vent.
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