System and method for bonding over active integrated circuits
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United States of America Patent
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May 15, 2001
Grant Date -
N/A
app pub date -
Jul 2, 1999
filing date -
Jul 14, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An architecture and method of fabrication for an integrated circuit having a reinforced bond pad comprising at least one portion of the integrated circuit disposed under the bond pad; and this at least one circuit portion comprises at least one dielectric layer and a patterned electrically conductive reinforcing structure disposed in this at least one dielectric layer.
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